Sensor module for measuring surfaces
US7239153B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2003 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Feb 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to a sensor module for measuring structures in a surface, especially in a finger surface being moved over the sensor module, that includes a number of sensor elements, and an outer electrode located aside the sensor elements, the sensor elements being coupled to at least one AC drive circuit providing a varying current or voltage, thus coupling a signal through the sensor elements to the outer electrode.The sensor elements are also coupled to an electronic circuit positioned on a substrate, the substrate includes conductor leads coupling the sensor elements to the electronic circuit, and the electronic circuit being adapted to measure the magnitude of the capacitance or AC impedance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.