Electronic assembly with modular midplane
US7239523B1 · kind B1 · utility
20Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2005 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Jun 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1445
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular electronic assembly includes a chassis, a housing supported by the chassis having an access opening through a first wall of the housing, a removable access panel or releasable member at least partially covering the opening, and a midplane supported by the chassis and slidably removable from the chassis through the opening when the housing is mounted on the chassis. A method of constructing a modular electronic assembly is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.