Packaging apparatus for optical interconnection on optical printed circuit board
US7239767B2 · kind B2 · utility
25Cited by
7References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2004 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Nov 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0274
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.