Polishing pad, method of producing same and method of polishing
US7241204B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2006 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Sep 7, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70 MPa or less and preferably in the range of 40 MPa or greater and 60 MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 μm or greater and less than 0.5 μm, and preferably in the range of 0.005 μm or greater and 0.2 μm or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.