System configured for applying a modifying agent to a non-equidimensional substrate
US7241340B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2003 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Jul 30, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D2401/90
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.