Method and apparatus for molding a semiconductor device
US7241414B2 · kind B2 · utility
5Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2004 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | May 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface of a semiconductor device located in the mold. A compliant tape is positionable onto the mold half comprising the sealing mechanism between the semiconductor device and the sealing mechanism for molding of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.