Radiation emitting semiconductor component having a nitride compound semiconductor body and a contact metallization layer on its surface
US7242025B2 · kind B2 · utility
10Cited by
22References
48Claims
0Family size
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Key dates
| Filing date | Jan 31, 2003 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Mar 31, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
Abstract
A radiation-emitting semiconductor component has a semiconductor body containing a nitride compound semiconductor, and a contact metallization layer disposed on a surface of the semiconductor body. In this case, the contact metallization layer is covered with a radiation-transmissive, electrically conductive contact layer. The radiation generated is coupled out through the contact metallization layer or through openings in the contact metallization layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.