Patent · US Expired

Radiation emitting semiconductor component having a nitride compound semiconductor body and a contact metallization layer on its surface

US7242025B2 · kind B2 · utility

10Cited by
22References
48Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 31, 2003
Grant dateJul 10, 2007
Priority date
Expiry dateMar 31, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3025

Abstract

A radiation-emitting semiconductor component has a semiconductor body containing a nitride compound semiconductor, and a contact metallization layer disposed on a surface of the semiconductor body. In this case, the contact metallization layer is covered with a radiation-transmissive, electrically conductive contact layer. The radiation generated is coupled out through the contact metallization layer or through openings in the contact metallization layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.