Method of manufacturing a data carrier
US7242079B2 · kind B2 · utility
6Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2003 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Oct 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a data carrier from a support strip includes an overmoulding step, in which at least one support element of the support strip is overmoulded so as to obtain a data carrier body, and a microcircuit-connecting step, in which a microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.