Method for manufacturing semiconductor device with plural semiconductor chips
US7242100B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 10, 2005 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Feb 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a semiconductor device with plural semiconductor chips is provided. The method includes the step of attaching a second semiconductor chip to a first surface of a supporting member in a manner such that a third set of electrodes are wirelessly connected to the supporting member at positions outwardly from an opening of the supporting member. The method also includes the step of mounting a first semiconductor chip to the second semiconductor chip in a manner such that the main surfaces of the first and second semiconductor chips face each other while a first set of electrodes of the first semiconductor chip are wirelessly connected to a second set of electrodes in the opening of the supporting member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.