Patent · US Expired

System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers

US7242579B2 · kind B2 · utility

15Cited by

4References

13Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Kenneth R. Fernandez · Pelham, US
Claudio Fleiner · San Jose, US
Robert B. Garner · San Jose, US
Harald Huels · Eppelheim, DE
Manfred Ries · Mainz, DE
Winfried W. Wilcke · Los Altos Hills, US

Key dates

Filing date	Jan 9, 2004
Grant date	Jul 10, 2007
Priority date	—
Expiry date	Jan 14, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49169
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling system includes at least one coldrail to facilitate the removal of heat from the at least one compute, storage, or communications brick. Also, the three-dimensional computer infrastructure includes a brick-internal carrier within the at least one compute, storage, communications brick, wherein the brick-internal carrier is attached to the at least one coldrail. Moreover, the three-dimensional computer infrastructure includes a power dissipating electronic element within the at-least-one compute, storage, or communications brick, wherein the power dissipating element is attached to the brick-internal carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.