Method and apparatus for generating a wafer map
US7243325B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2004 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Aug 19, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/392
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system is provided to aid in laying out circuits on a semiconductor wafer, in which a wafer map is automatically generated when entering chip sizes, arrangements and other enterable factors, with a goal to maximize yield probability. The subject system accommodates different chip types and arrangements within a wafer map and addresses edge exclusion, utilization of chiplets and accommodation of different centering techniques, including a variety of ways of measuring offsets, while outputting a display of replicated circuits on the wafer as well as chip count and density, utilizing a portable, tailorable, extendable PC-based program featuring an easy-to-use graphical interface. The software application provides a user with different graphical views customized for different process areas, such as lithography and dicing, with the application being useful for any semiconductor manufacturing facility, foundry or similar industry that needs to generate wafer maps automatically to maximize yield probability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.