Apparatus for vacuum treating two dimensionally extended substrates and method for manufacturing such substrates
US7244086B2 · kind B2 · utility
6Cited by
23References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2003 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | Sep 13, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vacuum transport chamber has a transport robot arrangement. A processing arrangement has at least one processing station communicating by at least one workpiece pass-through opening with the vacuum transport chamber. A loadlock arrangement communicates by at least one workpiece pass-through opening with an atmosphere outside the vacuum transport chamber and the processing arrangement. One single loadlock and processing tower is formed by the processing arrangement and the loadlock arrangement being arranged vertically on upon the other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.