Hot runner nozzle and manifold seal
US7244118B2 · kind B2 · utility
5Cited by
25References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 9, 2004 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | Jun 29, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2791
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection molding apparatus includes combined sealing elements located between a nozzle head of an injection molding nozzle and a mold plate. The sealing elements are arranged so that they force the nozzle head toward an outlet surface of a manifold and provide a seal therebetween over a range of temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.