Copper alloy powder for electrically conductive paste
US7244286B2 · kind B2 · utility
2Cited by
4References
4Claims
0Family size
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Inventor
Key dates
| Filing date | Nov 28, 2002 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | Nov 28, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A copper alloy powder for an electrically conductive paste is provided, which is characterized in that the copper alloy powder comprises 80 to 99.9 mass % of Cu and 0.1 to 20 mass % of one or two elements selected from the group consisting of Ta and W and has an average particle size of 0.1 to 1 μm. This copper alloy powder has a higher starting temperature for sintering, higher oxidation resistance and better heat resistance than a copper powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.