Over-clocking in a microdeposition control system to improve resolution
US7244310B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2002 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | May 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles that fire droplets having a deposited width when deposited on the substrate. A positioning device moves the microdeposition head (50) relative to the substrate at a head speed. A controller (22) generates over-clocking signals at a rate that is substantially greater than the head speed divided by the droplet width to improve resolution. The controller (22) includes a positioning module that generates position control signals for the positioning device. The controller (22) includes a nozzle firing module (114) that generates nozzle firing commands based on the over-clocking rate to fire the nozzles to form droplets that define features on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.