Silicone-free multilayer shrink film for high speed packaging lines
US7244507B2 · kind B2 · utility
4Cited by
13References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2005 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | Aug 13, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31928
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Multilayer shrink films and methods of making same that are substantially free of silicone. The multilayer shrink films of the invention are produced using film biaxial orienting means, have haze values of 5 or less and Young's modulus of 40,000 psi or greater and superior hot slip properties. Cyclic-olefin copolymer (COC) is used in the outermost layers to impart superior hot slip. Preferably the film comprises large proportion of linear low density polyethylene (LLDPE) or ethylene propylene butane terpolymer. Suitable COCs for use in the invention are limited to single site catalyzed COC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.