Stain-etched silicon powder
US7244513B2 · kind B2 · utility
20Cited by
13References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2003 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | Jun 3, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2993
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention is for a porous silicon powder comprising silicon particles wherein the outermost layers of said particles are porous. The present invention is also directed to a method of making this porous silicon powder using a stain etch method. The present invention is also directed to a method of making silicon nanoparticles from the porous silicon powders using a process of ultrasonic agitation. The present invention also includes methods of processing these silicon nanoparticles for use in a variety of applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.