Patent · US Expired

Method and device for the production of thin epitaxial semiconductor layers

US7244667B2 · kind B2 · utility

0Cited by
12References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 25, 2002
Grant dateJul 17, 2007
Priority date
Expiry dateFeb 18, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/02658
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

System for producing diffusion-inhibiting epitaxial semiconductor layers, by means of which thin diffusion-inhibiting, epitaxial semiconductor layers can be produced on large semiconductor substrates at a high throughput.The surfaces of the semiconductor substrates to be coated are first cleaned, and the substrates are then heated in a low pressure batch reactor to a first temperature (prebake temperature). The surfaces to be coated are next subjected to a hydrogen prebake operation at a first reactor pressure. In the next step the semiconductor substrates are heated in a low pressure hot or warm wall batch reactor to a second temperature (deposition temperature) lower than the first temperature, and after a condition of thermodynamic equilibrium is reached the diffusion-inhibiting semiconductor layers are deposited on the surfaces to be coated in a chemical gaseous deposition process (CVD) at a second reactor pressure higher than, equal to or lower than the first reactor pressure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.