Energy monitoring or control of individual vias formed during laser micromachining
US7244906B2 · kind B2 · utility
12Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2005 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | Aug 30, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system increase the quality of results achieved by laser micromachining systems. Data relating to parameters controlling laser micromachining process are recorded during the micromachining process, identified by the feature associated with the parameters used to micromachine, and stored on the system. The stored data can be either retrieved during the micromachining process to enable real time control or retrieved after workpiece processing to conduct statistical process control.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.