Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
US7245006B2 · kind B2 · utility
2Cited by
10References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 25, 2005 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | Aug 25, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.