Modular electronics enclosure
US7245497B2 · kind B2 · utility
23Cited by
23References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2005 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | Aug 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/142
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular electronics enclosure for one or more circuit card assembly includes top and bottom lids formed substantially the same with at least one intermediate circuit card support member disposed therebetween. At least one spring clip clamps the top and bottom lids together around the intermediate support member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.