Plate package, method of manufacturing a plate package, use of a plate package and plate heat exchanger comprising a plate package
US7246436B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2002 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Sep 2, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49366
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention refers to a plate package for a plate heat exchanger, a method for manufacturing a plate package, a use of a plate package, and a plate heat exchanger. The plate package includes a plurality of heat exchanger plates (1), which are stacked on each other and which each includes a number of portholes. The plates (1) are compression molded and permanently connected to each other in a number of joints in such a manner that the plates between each other form a first passage for a first fluid and a second passage for a second fluid. The plate package is designed to permit at least one of the fluids to flow through the respective passages at a predetermined maximum working pressure. The plate package has an increased strength achieved by subjecting at least one of the passages to at least a local inner plastic deformation of the plate package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.