Message board assembly
US7246458B2 · kind B2 · utility
12Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2004 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Apr 30, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09F7/04
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A message board assembly including a support layer, a top layer, and a magnetic attachment layer. The top layer is coupled to a top surface of the support layer and may include a dry erase surface. The magnetic attachment layer is coupled to a bottom surface of the support layer and extends substantially across the entirety of the bottom surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.