Method and apparatus for managing the temperature of thermal components
US7246940B2 · kind B2 · utility
26Cited by
37References
67Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2003 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Jun 24, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A temperature management system for managing the temperature of a discrete, thermal component. The temperature management system comprises a heat exchanger thermally coupled with the thermal component. The system also comprises a fluid transfer device that circulates a coolant fluid through a thermal conduit system. As the coolant flows through the heat exchanger, it absorbs heat from the component. Upon exiting the heat exchanger, the heated coolant flows to the beat sink where the heat sink absorbs heat from the coolant fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.