Bonded three dimensional laminate structure
US7247030B2 · kind B2 · utility
2Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2004 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Apr 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/582
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive structure and method of manufacturing therefor includes a plurality of stacked metal laminates secured to one another via an intermetallic bond made from a metallic bonding agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.