Molded semiconductor device with heat conducting members
US7247929B2 · kind B2 · utility
10Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2004 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Jul 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power element package includes a semiconductor chip, radiating members, a mold resin member, a lead terminal for control signals, and lead terminals for large electric current. On a heat accepting surface of the radiating member, an insulating layer and a conductive layer are disposed. The lead terminal for control signals is electrically connected with a gate of the semiconductor chip through the conductive layer. An emitter of the semiconductor chip is electrically connected through a solder connection member with a non-insulating portion of the heat accepting surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.