Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body

US7247940B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Thomas Hofer · Auenwald, DE
• Herbert Brunner · Sinzing, DE
• Frank Möllmer · Bad Abbach, DE
• Gunter Waitl · Regensburg, DE
• Rainer Sewald · Taufkirchen, DE
• Markus Zeiler · Nittendorf, DE

Key dates

• Filing date: Mar 1, 2004
• Grant date: Jul 24, 2007
• Expiry date: Mar 1, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506

Abstract

An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.