Method for marking defect and device therefor
US7248366B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2001 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Aug 27, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/89
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The defect marking method comprises the steps of: installing a surface defect tester to detect surface flaw and a marker device to apply marking at defect position, in a continuous processing line of steel sheet; detecting the surface flaw on the steel sheet using the surface defect tester; determining defect name, defect grade, defect length, and defect position in the width direction of the steel sheet, on the basis of thus detected flaw information, further identifying the defect in terms of harmful defect, injudgicable defect, and harmless defect; applying tracking of the defect position for each of the harmful defect and the injudgicable defect; and applying marking to the defect position. The defect marking device comprises a defect inspection means having plurality of light-receiving parts and a signal processing section, and a marking means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.