Method and device for the robot-controlled cutting of workpieces to be assembled by means of laser radiation

US7248940B2 · kind B2 · utility

Assignees

• Thyssen Laser-Technik GmbH · DE
• Reis GmbH & Co. KG Maschinenfabrik · DE

Inventors

• Günter Neumann · Ochsenhausen, DE
• Friedrich Behr
• Axel Fischer · Moischeid, DE
• Eberhard Kroth · Obernburg, DE
• Stefan Seiler · Zürich, CH
• Franz Som · Bad König, DE
• Rolf P. Maisch · Boppelsen, CH
• Wolfgang Zesch · Zürich, CH

Key dates

• Filing date: May 16, 2002
• Grant date: Jul 24, 2007
• Expiry date: Jun 23, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23Q27/00
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

In a method for robot-controlled cutting of workpieces to be joined by laser radiation, a first workpiece is arranged in vicinity of a second workpiece in a first position. A laser is focused onto the first workpiece. A contour of the first workpiece is cut with the laser beam; this contour is to be assembled and joined with the second workpiece. During cutting, a first spacing of a focal point of the laser beam from the second workpiece is repeatedly determined in a distance direction that is identically oriented during cutting and is adjusted to a direction of assembling the first and second workpieces. During cutting, a second spacing of a processing point of the laser beam from the second workpiece is maintained at a constant value.