Tube and die interface for liquid flow sensing through the tube
US7249503B2 · kind B2 · utility
0Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2005 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | Oct 2, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F1/6847
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal sensor includes a die having a surface formed to accept the outer surface of tubing; a molded plastic part located on the die surface, said molded plastic part including flexible portions having a surface adapted to engage the bottom half of the circumference of standard tubing when the tubing is fully placed in the molded plastic part; conductive material selectively patterned on the surface of the flexible portions that engages the die surface; and retaining hardware adapted to secure the tubing against the molded plastic part and flexible portions when the retaining hardware is secured to the molded plastic part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.