Soldering a flexible circuit
US7249826B2 · kind B2 · utility
1Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2004 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | Jun 11, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Techniques are provided for controlling solder flow in applications where a flexible circuit is soldered to a microelectromechanical structure. A metal layer is formed on a substrate. A solder mask is formed on the metal layer such that portions of the metal layer are covered by the mask and portions are left exposed. A flexible circuit is soldered to the metal layer in at least some of the areas where the metal layer is exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.