Array optical sub-assembly
US7249896B2 · kind B2 · utility
3Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2005 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | Mar 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An array optical sub-assembly includes a base seat, an integrated circuit, a transparent substrate and a photoelectric element. The integrated circuit and the photoelectric element are bonded respectively to the base seat and the transparent substrate. The base seat and the transparent substrate form a sealed space to protect the elements. The photoelectric element and the integrated circuit are separated to avoid thermal interference between the photoelectric element and the integrated circuit. Therefore total performance is increased and fabrication difficulty is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.