Patent · US Expired

Method of forming a via in a microfabricated elastomer structure

US7250128B2 · kind B2 · utility

100Cited by
55References
4Claims
0Family size

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Key dates

Filing dateApr 20, 2005
Grant dateJul 31, 2007
Priority date
Expiry dateMar 16, 2026

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T137/87877
  • WIPO fieldMechanical elements
  • WIPO sectorMechanical engineering

Abstract

A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.