Method and system of releasing a MEMS structure
US7250353B2 · kind B2 · utility
92Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2005 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | Apr 21, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00333
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMs (microelectromechanical systems) structure is provided. In one implementation, the MEMs structure includes a substrate wafer including a MEMs device formed on a surface of the substrate wafer, and a MEMs cover structure to cover the MEMs device formed on the surface of the substrate wafer. The MEMs cover structure comprises a first wafer bonded to a second wafer, in which only the first wafer of the MEMs cover structure is sawed through and not the second wafer of the MEMs cover structure during dicing of the MEMs structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.