Magnetic sensor
US7250760B2 · kind B2 · utility
48Cited by
1References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2006 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | Sep 29, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The magnetic sensor is fabricated such that a magnetic sensor chip, having a one-chip structure in which MRE bridges and a comparator are included, is mounted onto a lead frame using an adhesive material, and then the magnetic sensor chip mounted on the lead frame is encapsulated by molding in a molded material. The magnetic sensor includes a magnetic-field generating portion formed by magnetizing at least one of the chip mounting member, the adhesive material, and the encapsulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.