LED array package with internal feedback and control
US7252408B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2004 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | Sep 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10155
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A packaged LED array for high temperature operation comprises a metal base, the metal base including an underlying thermal connection pad. One or more layers of ceramic overly the metal base. The array includes a plurality of LED dice, each LED die having electrodes. And, the LED thermally coupled to the metal base. A driver circuit is electrically connected to the LED die electrodes and controls the LED array current. An LED driver is mounted within the LED array package, and thermally coupled to the metal base. In a second embodiment, one or more of the LED dice can be switched from the driver to a measurement circuit and used as a photodetector to measure the light output of the LED array. The measured photodetector signal can further be used as a feedback signal to control the LED array light output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.