Devices and methods for aligning a stamp and a substrate
US7252492B2 · kind B2 · utility
19Cited by
5References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2003 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | Dec 29, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
There is provided a device for transferring a pattern from a stamp to a substrate, provided with a moldable film, by pressing the stamp and the substrate against each other. The device comprises at least one fixture for retaining a planar object such as the stamp or the substrate. The device is distinguished in that it comprises a heating element for heating the planar object, and measuring arrangement for determining a change in the size of the planar object due to the heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.