Dual-interface IC card by laminating a plurality of foils and method of same
US7253024B2 · kind B2 · utility
3Cited by
3References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2003 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | Sep 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for manufacturing IC card by laminating a plurality of foils. The method of the present invention includes steps of putting a COB, a contact electrode of the COB facing downward; laying at least 2 foils having a hole, wherein said COB is inserted in said respective holes of the foils; laying a foil not having a hole on the foils having a hole; and compressing all of the foils.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.