Image sensor packaging method and structure thereof
US7253028B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 24, 2004 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | May 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
Abstract
A method for packaging an image sensor includes the steps of providing a substrate, forming a first adhesive on one surface of the substrate, attaching a transparent material on the first adhesive, cutting or carving the surface of the transparent material to a depth penetrating the transparent material while not penetrating the first adhesive, cleaning the cut or carved surface of the transparent material, depositing a frame glue on the transparent material, and combining the transparent material with a microchip that includes a plurality of micro-lenses. The micro-lens is packaged within the transparent material. The microchip is then ground to perform a lithography process. Next, the substrate and part of the first adhesive are detached after the lithography process. After performing a cutting or carving procedure, the packaging process of the image sensors is completed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.