Processor module for system board
US7254027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2004 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | Nov 3, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.