3U payload module configurations
US7254039B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2004 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | Oct 12, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/183
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A multi-service platform system (100, 200, 300, 400) includes a computer chassis (101, 201, 301, 401) having a plurality of 3U slots (205), a backplane (104) integrated in the computer chassis, a switched fabric (106) on the backplane. At least one of a VMEbus network and a PCI network are coincident with the switched fabric on the backplane. A payload module (102) having a 3U form factor is coupled to interface with one of the plurality of 3U slots, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.