Wafer-level fabrication method for top or side slider bond pads
US7254885B2 · kind B2 · utility
5Cited by
9References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2002 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Aug 2, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49798
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the substrate and filled with a bond pad material to form slider bond pads. Excess bond pad material is removed from the trenches such that the slider bond pads are flush with the top surface of the substrate. A transducer is fabricated on the top surface of the substrate. Finally, the slider bond pads are exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.