Thermal fluid flow sensor and method of forming same technical field
US7255001B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2006 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Jul 25, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F1/692
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal fluid flow sensor and method of forming same. The flow sensor has an integrated circuit substrate, such as a silicon substrate, and a region of low thermal conductivity material carried on the top surface of the integrated circuit substrate. One or more pairs of temperature sensing elements are disposed on the low thermal conductivity region together with a heating element so that a robust flow sensor can be provided at low cost. Signal conditioning circuitry is disposed on the same surface as the temperature sensing elements and connected to the sensing elements thereby further reducing costs and improving the flow sensor sensitivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.