Molded part and electronic device using the same
US7255610B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2005 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Mar 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/24
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and a resin, obtaining stable frictional force at the contact region between the bonding surface of the electrical connection terminal and an aluminum wire, obtaining the energy required for bonding, and achieving high bondability. The surface of the molded electrical connection terminal section formed as a primary-molded article becomes exposed after secondary molding, and a stress-absorbing structure is formed in the primary molding resin section of the primary-molded article that serves as a transmission path for stresses associated with the resin shrinkage occurring when the secondary molding resin is cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.