Substrate processing method, method of manufacturing micro lens sheet, transmission screen, projector, display device, and substrate processing apparatus
US7255806B2 · kind B2 · utility
8Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2004 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Mar 10, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B3/0031
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate processing method is provided including: shaping a laser beam emitted from a laser beam source into a beam having a focal depth larger than the maximum value of a variation in thickness of a processing area portion of a processed substrate and the maximum value of a variation in bend thereof by making the laser beam pass through an diffractive optical element; forming plural etching holes by irradiating the shaped beam onto a film formed on the substrate to remove the film; and forming plural recessed portions by etching the substrate through the plural etching holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.