Polishing slurry for texturing
US7255809B2 · kind B2 · utility
2Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2003 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Feb 27, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/8404
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Polishing slurry for texturing the surface of a magnetic hard disk substrate has abrading particles with diameters in the range of 1-10 nm dispersed in a dispersant such as water and a water-based aqueous solution. The abrading particles may be monocrystalline diamond particles, polycrystalline diamond particles or cluster particles with monoerystalline and polycrystalline diamond particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.