Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
US7256495B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2003 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Jul 1, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package substrate is manufactured by electrolytically plating Au in a semi-additive manner without using any plating lead line. Such a package substrate includes a base substrate with a plurality of through holes, a first copper plated layer on portions of the base substrate and inner surfaces of the through holes, a plated pattern layer on the first copper plated layer, wire bonding pads on the plated pattern layer at an upper surface of the base substrate, the wire bonding pads including Au and not connected to a remnant of a plating lead line, solder ball pads on the plated pattern layer at a lower surface of the base substrate, the solder ball pads including Au and not connected to a remnant of a plating lead line, and a solder resist covering the base substrate and the plated pattern layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.