Circuit support for a semiconductor chip and component
US7256504B2 · kind B2 · utility
0Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2005 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Aug 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01033
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral area surrounding the central area defines the border of the chip mounting area and it is of a far greater length than a length of the lateral edges of the chip to be mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.