Temperature compensated crystal oscillator and method of manufacturing same
US7256659B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2005 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Mar 28, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03L1/028
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A temperature compensated crystal oscillator has a package body, a crystal blank hermetically sealed in a first recess of the package body, and an IC chip which includes an oscillation circuit electrically connected to the crystal blank, and a temperature compensating mechanism for compensating the crystal blank for the frequency-temperature characteristic. The oscillation circuit and temperature compensating mechanism are integrated into the IC chip. The IC chip is received in a second recess of the package body such that a circuit formation surface thereof faces the bottom face of the package body. External write terminals are formed on a principal surface of the IC chip, which is not the circuit formation surface, for writing temperature compensation data into the temperature compensating mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.