System for mounting and cooling circuit boards
US7256992B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2004 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Apr 13, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20672
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computer system may include one or more modules coupled to a backplane in a housing. A module support structure may allow cooling air to flow upwardly across the modules. In one embodiment, a power section of the module may be located downstream of a data section of the module. In another embodiment, offset brackets may hold a circuit board of a module at an offset relative to a pair of guides in a module support structure. In another embodiment, a heat sink may be coupled between heat producing components on a pair of adjacent modules. In another embodiment, a converter apparatus may support a plurality of modules in a different number of slots in a system. In another embodiment, a heat sink on a module may include a pair of heat pipes arranged such that the heat pipes diverge from one another toward the condenser ends of the heat pipes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.